Method for mounting a semiconductor device in a housing

Details Method for mounting a semiconductor device in a housing Method for mounting a semiconductor device in a housing

1980-12-22

1983-11-29

Sheehan, John P.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 357 71, 357 81, H01L 724

Patent

active

044173865

ABSTRACT:
Method and apparatus for mounting a semiconductor device in a housing, which includes first providing a metallization on a part of the surface of the semiconductor body of the semiconductor device to be connected to the housing, subsequently permanently connecting the semiconductor body to a part of the housing being in the form of a substrate with an organic adhesive to which metal particles have been added, and connecting electrodes of the semiconductor device to terminals disposed in the housing.

REFERENCES:
patent: 2809332 (1957-10-01), Sherwood
patent: 3617821 (1971-11-01), Einthoven
patent: 3770565 (1973-11-01), Schoolar
patent: 3794517 (1974-02-01), Yperman et al.
patent: 3828227 (1974-08-01), Millard et al.
patent: 4127424 (1978-11-01), Ullery
patent: 4293587 (1981-10-01), Trueblood
Engelhard Data Sheet, Engelhard Industries-Electro Metallic, E. Newark, N.J., Jan. 1976.

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