Semiconductor device with heat radiating fin assembly and contai

Details Semiconductor device with heat radiating fin assembly and contai Semiconductor device with heat radiating fin assembly and contai

1994-12-14

1995-10-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257707, 361727, H05K 720

Patent

active

054596386

ABSTRACT:
A semiconductor device is provided with a rectangular package body, a large number of leads projecting out from the body, and a heat radiating fin assembly on top of the package body. The heat radiating fin assembly is constructed of a support column extending vertically from the top surface of the package body and at least one heat radiating fin extending outwardly from the support column in a radial direction. The heat radiating fin is supported by direct or indirect engagement within a container for accommodating and holding the semiconductor device. The support is achieved in such a way that the leads of the device are held out of contact with the inside of the container and such that the device is accommodated and held within the container in a predetermined orientation.

REFERENCES:
patent: 4366526 (1982-12-01), Lijoi
patent: 4535384 (1985-08-01), Wakabayashi
patent: 4546407 (1985-10-01), Benenati
patent: 5007858 (1991-04-01), Daly
patent: 5019940 (1991-05-01), Clemens
patent: 5055914 (1991-10-01), Shimizu
patent: 5077638 (1991-12-01), Andersson
patent: 5132875 (1992-07-01), Plesinger
patent: 5375652 (1994-12-01), Matsunaga

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