Surface acoustic wave device mounted module

Details Surface acoustic wave device mounted module Surface acoustic wave device mounted module

1994-07-22

1995-10-17

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310344, H01L 4108

Patent

active

054593689

ABSTRACT:
This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate which has at least one layer of a shield pattern, input-output electrodes, grounding electrodes, through holes used for connecting electrodes, and a surface acoustic wave element. The surface acoustic wave element has metallic bumps, which are transfer-coated with a conductive resin, on electrode pads and an insulating resin around the surface acoustic wave element. The electrode pads are input-output terminals and grounding terminals formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the through holes. An electrode pattern is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid is attached to the electrode pattern by a solder or a conductive resin so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the through holes.

REFERENCES:
patent: 4683394 (1987-07-01), Koshino
patent: 4734608 (1988-03-01), Takashima et al.
patent: 4736128 (1988-04-01), Takoshima et al.
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patent: 5237235 (1993-08-01), Cho et al.
patent: 5281883 (1994-01-01), Ikata et al.
English Language European Search Report dated Dec. 23, 1994.
Miniaturized SAW Devices for Radio Communication Transceivers (pp. 2-8).
The Development of a Surface Mount Hybrid if Section Using Low Loss Saw Filters, (pp. 283-288).
Chip-on-Glass Packaging Technology Using Conductive Particles (pp. 99-103).
Flip Chip Assembly of of Surface Aoustic Wave Devices (pp. 36-39).

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