Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-05-12
1988-08-16
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
501 4, 501 11, 501 55, 501 60, 501 61, 501 62, 501 63, 501 65, B32B 1800, B32B 3104
Patent
active
047642335
ABSTRACT:
This invention provides a ceramic multi-layer circuit board wherein electroconductive patterns and ceramic insulating layers are piled alternately, characterized in that each ceramic insulating layer is a sintered product comprising one or more kinds of silica and a glass. Since the glass has a softening point lower than the melting point of the material of the electroconductive patterns, it enables sintering of the ceramic multi-layer circuit board at low temperatures. The silica is effective for reduction of the dielectric constant of each ceramic insulating layer.
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Ogihara Satoru
Ushifusa Nobuyuki
Hitachi , Ltd.
Weston Caleb
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