Method of forming lead frame with strengthened encapsulation adh

Details Method of forming lead frame with strengthened encapsulation adh Method of forming lead frame with strengthened encapsulation adh

1994-04-18

1995-10-17

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, 437220, 257666, 257667, 257734, 257735, 257736, 257780, 257781, H01L 2160

Patent

active

054591031

ABSTRACT:
This invention relates to a process for strengthening the adhesive bond between a lead frame and a plastic mold compound (350). The process involves plating the lead frame with a copper strike and selectively exposing the copper strike to an oxidizing agent to form a layer of cupric oxide (CuO) (318). Such lead frames are fitted with chips (324) and then encapsulated in the plastic mold compound (350), whereby the adhesive bond forms directly between the layer of CuO (318) and the plastic mold compound (350). A lead frame produced by this process may include a plurality of leads (310) having lead ends (312) and lead fingers (314) and a die pad (320) having a layer of CuO (318). The die pad (320) is encased by a plastic mold compound (350) which forms an adhesive bond directly with the layer of CuO (318). This layer (318) may have a thickness in a range of about 5 to 50.mu. inches (12.7 to 127 .mu.cm). Lead ends (312 ) and lead fingers (314) may be spot-plated with silver or palladium.

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