Process for manufacturing and mounting a semiconductor device le

Details Process for manufacturing and mounting a semiconductor device le Process for manufacturing and mounting a semiconductor device le

1996-02-16

1997-07-01

Graybill, David E.

Fishing, trapping, and vermin destroying

437217, 437220, H01L 2156, H01L 2158, H01L 2160

Patent

active

056438354

ABSTRACT:
A process of mounting a semiconductor device and leadframe to a printed circuit board are described. The device has a body, and a plurality of leads extending from the body. One or more alignment features are formed on the exterior of the package body, for maintaining precise alignment of the device with respect to a printed wiring board. The alignment feature is a tab formed as part of portion of the leadframe external to the package body. The tab may have various shapes, and may be provided with a hole for registering with a pin on an underlying substrate, such as a printed wiring board. The pin and the tab may be electrically connected.

REFERENCES:
patent: 5018005 (1991-05-01), Lin et al.
patent: 5104827 (1992-04-01), Schneider et al.
patent: 5177326 (1993-01-01), Goldhammer

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