Process for manufacturing a semiconductor substrate comprising l

Details Process for manufacturing a semiconductor substrate comprising l Process for manufacturing a semiconductor substrate comprising l

1995-05-25

1997-07-01

Graybill, David E.

Fishing, trapping, and vermin destroying

437211, 437238, 437241, 437245, H01L 2148, H01L 2156, H01L 2158, H01L 2160

Patent

active

056438346

ABSTRACT:
A process for manufacturing a plastic package type semiconductor device composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the substrate. The film may be a single-layer film made of silicon oxynitride or a composite film formed by laminating a silicon oxide layer and a silicon oxynitride layer (or a silicon nitride layer). A semiconductor element is mounted on the film or on the exposed surface of the substrate. Other passive elements are provided on the film. After connecting these elements with bonding wires, the entire device is sealed in a resin molding. This device is thus free of cracks due to difference in thermal expansion between the film and the substrate, or peeling due to moisture absorption.

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