Method of making multilayered glass-ceramic structures having an

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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264 58, 264 61, 264 62, 264 65, 264 66, 427 96, B32B 3124, C03B 3200, C04B 3900

Patent

active

042343674

ABSTRACT:
The formation of sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H.sub.2 O at temperatures below the melting point of copper.

REFERENCES:
patent: 3423517 (1969-01-01), Arrhenius
patent: 3637435 (1972-01-01), Schwyn
patent: 3770529 (1973-11-01), Anderson

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