Fishing – trapping – and vermin destroying
Patent
1994-05-16
1997-07-01
Niebling, John
Fishing, trapping, and vermin destroying
437 51, 437 60, 437915, 437919, H01L 21265, H01L 2170, H01L 2700
Patent
active
056438044
ABSTRACT:
A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit. During the firing of passive circuit element in a hydrogen atmosphere, the semiconductor layer which constitutes the integrated circuit is also heat annealed. Various substrates can be used as the substrate, for example, quartz, ceramic and a cheap semiconductor substrate which has not been treated with a mirror-grinding by the use of a glass layer.
REFERENCES:
patent: 4494996 (1985-01-01), Ohno et al.
patent: 4639826 (1987-01-01), Val et al.
patent: 4714981 (1987-12-01), Gordon
patent: 4734819 (1988-03-01), Hernandez et al.
patent: 4974039 (1990-11-01), Schindler et al.
patent: 5077225 (1991-12-01), Lee
patent: 5135883 (1992-08-01), Bae et al.
patent: 5236850 (1993-08-01), Zhang
patent: 5353498 (1994-10-01), Fillion et al.
Nikkei Electronics, No. 581, pp. 82-87 (May 24, 1993).
Arai Michio
Nagano Katsuto
Sakamoto Naoya
Yamauchi Yukio
Butts Karlton C.
Dutton Brian K.
Ferguson Jr. Gerald J.
Niebling John
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Method of manufacturing a hybrid integrated circuit component ha does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a hybrid integrated circuit component ha, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a hybrid integrated circuit component ha will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-596297