Soldering of electronic components

Details Soldering of electronic components Soldering of electronic components

1986-06-04

1988-08-16

Jordan, M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

B23K 3102

Patent

active

047638290

ABSTRACT:
Disclosed is a technique for providing solder bumps to electronic components, such as silicon chips, chip carriers, and circuit boards, so as to achieve large stand-off heights. The component is covered with a mask, such as a photoresist, leaving exposed the solder pads on the component. Solder is applied to the surface along with ultrasonic energy so that the solder wets the exposed pads. The mask acts as a mold for the solder, thereby producing large solder bump heights.

REFERENCES:
patent: 3084650 (1963-04-01), Johns
patent: 3266136 (1966-08-01), Gulbier
patent: 3599326 (1971-08-01), DiRenzo
patent: 3647533 (1972-03-01), Hicks
patent: 3966110 (1976-06-01), Boynton
patent: 4068792 (1978-01-01), Dixon
patent: 4254163 (1981-03-01), Piazza
patent: 4311267 (1982-01-01), Zim
patent: 4371912 (1983-02-01), Guzik
patent: 4373655 (1983-02-01), McKenzie
patent: 4421265 (1983-12-01), Boyer et al.
patent: 4560584 (1985-12-01), Henninger
"Wafer-Chip Assemby for Large-Scale Integration", IEEE Transactions on Electron Devices, vol. ED-15, Sept. 1968, pp. 660-663, Kraynak et al.
U.S. Patent Application of Herrero and Schaper, Ser. No. 658,799, filed Oct. 9, 1984.

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