Thermosetting resin compositions comprising bismaleimides and al

Details Thermosetting resin compositions comprising bismaleimides and al Thermosetting resin compositions comprising bismaleimides and al

1980-07-08

1982-04-06

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525257, 525259, 525260, 525261, 525276, 525282, 525328, 525334, 525336, 525375, 525379, 526261, 526262, C08F22052, C08F22240, C08F12240, C08F27102

Patent

active

043236626

ABSTRACT:
Disclosed is a thermosetting resin composition comprising (a) a bismaleimide and/or a polymaleimide and (b) at least one member selected from alkenylaniline derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated substance.

REFERENCES:
patent: 2989504 (1961-06-01), Little
patent: 3380964 (1968-04-01), Grundschober et al.
patent: 3651012 (1972-03-01), Holub et al.
patent: 3890272 (1975-06-01), D'Alelio
patent: 3929713 (1975-12-01), D'Alelio
patent: 3950279 (1976-04-01), Haug et al.
patent: 4089845 (1978-05-01), Haug et al.
patent: 4179551 (1979-12-01), Jones et al.
patent: 4216297 (1980-08-01), Vaughan et al.
patent: 4220741 (1980-09-01), Renner et al.
patent: 4229550 (1980-10-01), Jones et al.
Chem. Abst. vol. 91-58168f, (1979) "Heat Resistant Epoxy Resins" Kawamata et al., Mitsui Toatsu Chem., 3-26-79.

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