Method of slicing a semiconductor wafer and an apparatus

Details Method of slicing a semiconductor wafer and an apparatus Method of slicing a semiconductor wafer and an apparatus

1993-05-24

1995-10-17

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 41, 125 1302, B24B 4910, B24B 4908

Patent

active

054585260

ABSTRACT:
The present invention aims at proposing a method of slicing a semiconductor wafer and an apparatus therefor which can manufacture a bowl-shaped wafer. When the blade displacement is detected with the sensor 32, the displacement value of the blade 14 to the outer peripheral edge of the ingot 18 is obtained by the control unit 26. The air pad 30 is moved under controlling the air pressure control device 36 by the control unit 26 to make the blade displacement at the outer peripheral edge zero. As a result of this, the displacement of the wafer at the outer peripheral edge becomes zero, so that a bowl-shaped wafer can be manufactured.

REFERENCES:
patent: 3327696 (1967-06-01), Aiken et al.
patent: 5025593 (1991-06-01), Kawaguchi et al.
patent: 5313741 (1994-05-01), Toyama

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