Modular soldering nozzle

Details Modular soldering nozzle Modular soldering nozzle

1996-04-30

1997-07-01

Ramsey, Kenneth J.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

H05K 334

Patent

active

056428502

ABSTRACT:
The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Each of the series of processing stations includes at least one processing position, and the indexer indexes the parts from processing position to processing position. At different processing stations, the parts indexed into those processing stations are simultaneously processed.

REFERENCES:
patent: 3482755 (1969-12-01), Raciti
patent: 4363434 (1982-12-01), Flury
patent: 4569473 (1986-02-01), Guiliano
patent: 4832250 (1989-05-01), Spigarelli et al.
patent: 5148961 (1992-09-01), Humbert et al.
patent: 5176312 (1993-01-01), Lowenthal
Airvac Engineering Co., Inc. PCBRM12 brochure.
Wenesco, Inc, Wenesco Brochure.
Balog et al., "Surface Mount Component Soldering" U.S. Serial No. 08/225,263.
Pullen et al., "Packaging Electrical Components", U.S. Serial No. 08/337,245.

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