Heat sink and a process for the production of the same

Details Heat sink and a process for the production of the same Heat sink and a process for the production of the same

1994-06-09

1997-07-01

Flanigan, Allen J.

Heat exchange

Heat transmitter

165 803, 361704, H01L 23373

Patent

active

056427794

ABSTRACT:
A diamond heat sink having a very high thermal property, to be used for radiation of semiconductor devices or compressors, includes a plate-shaped diamond substrate and fins for increasing the thermal property. The fins are embedded in the substrate and are of a material having a heat conductivity of at least 1 (W/cm.multidot.K), for example, diamond. Such a heat sink can be produced by a simple process of arranging a base material and fins for growing diamond in such a manner that the surface of the base material and the upper end of the fins are substantially the same height by the use of a suitable supporting member or by working the base material itself and growing diamond thereon by a gaseous phase synthesis method.

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Proceedings of the Seventh IEEE Semiconductor Thermal Measurment and Management Symposium, Feb. 1991, New York, U.S., pp. 59-63, G.M. Harpole et al., "Mirco-channel heat exchanger optimization", * pp. 59-60, paragraph 2, figures 1-4 *.
Patent Abstracts of Japan, vol. 7, No. 45 (E-160) (1190) 23 Feb. 1983 & JP-A-57 196 552 (Nippon Denki) 2 Dec. 1982 * Abstract *.
Journal of the Electrochemical Society, vol. 138, No. 6, Jun. 1991, Manchester, New Hampshire, U.S., pp. 1706-1709, R. Ramesham et al., "Fabrication of microchannels in synthetic polycrystallline diamond thin films for heat sinking applications* ".

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