Stacked capacitor

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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Details

357 236, 357 55, 357 71, 361311, 361313, H01L 2978, H01L 2702, H01L 2348, H01G 406

Patent

active

048273236

ABSTRACT:
The present invention provides a structure and method for fabricating that structure which provides increased capacitance over the prior art while occupying a minimum of surface area of the integrated circuit. The present invention accomplishes this by interleaving multiple capacitor plates to provide increased capacitance while occupying the same surface area as a prior art capacitor providing a fraction of the capacitance provided by the present invention. The present invention is fabricated by providing a capacitor stack which includes interleaved plates of material which may be selectively etched and which is separated by appropriate dielectric material. One portion of the stack is masked while one set of the interleave plates is etched. The etched portion of the interleave plates is filled by a suitable dielectric and a contact is made to the remaining plates. A different portion of the stack is then exposed to an etch which etches the other set of interleave plates. The area etched away is then filled with a suitable dielectric and a contact is made to the unetched interleaved plates. Thus a fully interleaved capacitor is provided using relatively simple fabrication techniques while still providing increased capacitance.

REFERENCES:
patent: 3519901 (1970-07-01), Bean et al.
patent: 4017885 (1977-04-01), Kendall et al.
patent: 4249196 (1981-02-01), Durney et al.
patent: 4467450 (1984-08-01), Kuo
patent: 4567542 (1986-01-01), Shimada et al.

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