Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Patent
1987-01-30
1989-05-02
Eisenzopf, Reinhard J.
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With rotor
324158F, 324 73PC, 324 725, G01R 106, G01R 3102
Patent
active
048272116
ABSTRACT:
A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board form constant impedance transmission lines for connecting test equipment to the contact pads. A ground contact is mounted on the upper side of the substrate near the end on which the contact pads are mounted, the ground contact being connected by a conductive path to the ground conductors on the under side of the substrate. When two such wafer probes simultaneously access bonding pads on the same planar device, the ground conductors of the two probes are interconnected by a conductive sheet of foil extending between the ground contacts on the upper sides of the substrates of both wafer probes.
REFERENCES:
patent: 3963986 (1976-06-01), Morton et al.
patent: 4574235 (1986-03-01), Kelly et al.
patent: 4593243 (1986-06-01), Lao et al.
patent: 4686463 (1987-08-01), Logan
patent: 4697143 (1987-09-01), Lockwood et al.
Cascade Microwave; "Introducing the World's First Microwave Wafer Probing Equipment"; 1983 Cascade Microwave; pp. 1-3.
Malm; "Reduction of Stray Fields about SEM Samples"; IBM Technical Disclosure, vol. 21, No. 7; Dec. 1978, pp. 2973-2974.
Gleason Kimberly R.
Strid Eric W.
Cascade Microtech, Inc.
Eisenzopf Reinhard J.
Nguyen Vinh P.
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