Method of assembling electrical packaging structure and liquid c

Details Method of assembling electrical packaging structure and liquid c Method of assembling electrical packaging structure and liquid c

1993-12-20

1994-10-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361773, 361807, 174261, H05K 702

Patent

active

053531965

ABSTRACT:
A method of assembling an electrical packaging structure has a plurality of semiconductor chips arranged on a substrate and input wirings to the semiconductor chips connected thereto. The input wirings are distributed through a wiring board arranged on the substrate.

REFERENCES:
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patent: 3670208 (1972-06-01), Hovanian et al.
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patent: 4942453 (1990-07-01), Ishida et al.
patent: 5121297 (1992-06-01), Haas
patent: 5124826 (1992-06-01), Yoshioka et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5142449 (1992-08-01), Littlebury et al.

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