Modular power circuit assembly

Details Modular power circuit assembly Modular power circuit assembly

1993-10-24

1994-10-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 257707, 361736, 361764, H05K 720

Patent

active

053531949

ABSTRACT:
A modular construction power circuit arrangement is disclosed which comprises a thin metal plate performing holder and heat sink functions, a multiplicity of electronic devices in the form of semiconductor material chips having metalized pads as their terminals, a printed circuit board attached to the thin metal plate, electric conductors between the metalized pads and the printed circuit on the board, terminating connectors which form a part of the printed circuit board for connecting the circuit arrangement to external circuits, and a plastics material body which conglomerates a portion of the thin metal plate, the semiconductor material chips, and the printed circuit board. At least one of the semiconductor material chips is attached directly to the thin metal plate and extends therefrom through an opening in the printed circuit board.

REFERENCES:
patent: 4218724 (1980-08-01), Kaufman
patent: 4807019 (1989-02-01), Tustaniwskyj
patent: 4924296 (1990-05-01), Cini
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patent: 5012386 (1991-04-01), McShane
patent: 5045921 (1991-09-01), Lin
patent: 5081562 (1992-01-01), Adachi
patent: 5124783 (1992-06-01), Sawaya
patent: 5159532 (1992-10-01), Kilian
patent: 5222014 (1993-06-01), Lin
Kassotakis G. P., "High Power . . . Technique", Navy Technical Bulletin 11(4): 85-89, Jun. 1986.

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