Semiconductor device and method of production

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 239, 357 42, 357 59, H01L 2348

Patent

active

049857460

ABSTRACT:
A novel semiconductor device and method of production of such a device are provided. Both the N and P channels of the novel semiconductor device are formed by contact self-alignment, thereby permitting high speed operation and high density integration to be realized. The formation of the channels by contact self-alignment is accomplished by depositing a P type polysilicon layer on an N well region and an N type polysilicon layer on a P well region. A silicide layer if formed over both the P and N type polysilicon layers to form a polycide.

REFERENCES:
patent: 4333099 (1982-06-01), Tanguay et al.
patent: 4476482 (1984-10-01), Scott et al.
patent: 4477310 (1984-10-01), Park

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of production does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of production, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of production will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-58428

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.