Circuit assembly having interposer lead frame

Details Circuit assembly having interposer lead frame Circuit assembly having interposer lead frame

1992-12-04

1994-02-01

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, 361760, 361785, 257666, 257787, 174 522, 174255, 174260, H05K 502

Patent

active

052837173

ABSTRACT:
A circuit assembly includes a finger lead assembly having structure for supporting an interposer substrate assembly and an electronic circuit device, the substrate assembly having conductive elements for providing electrical connection between finger leads of the lead assembly and respective circuit sections within the circuit device. The circuit device is mounted proximate to an upper surface of the substrate assembly. At least one decoupling capacitor is mounted on a lower surface of the substrate assembly at a level below that of the finger leads and electrically connected, through circuitry within the substrate assembly including inter-level via connectors, to respective circuits within the circuit device.

REFERENCES:
patent: 4705917 (1987-11-01), Gates, Jr. et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
patent: 5105257 (1992-04-01), Michii

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