Magnetron sputtering cathode

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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C23C 1400

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active

048265845

ABSTRACT:
A magnetron sputtering cathode with a target plate of the material to be sputtered connected to a support body of non-magnetic material, having a chamber disposed between the support body and the target plate, with a coolant flowing through said chamber, said chamber being formed by a recess in said support body, with said recess being tightly covered by said target plate; and having a permanent magnet system disposed beneath the target plate, wherein the target plate (10) abuts the front side of a plate-shaped support body (13) and the likewise plate-shaped permanent magnet system (12) abuts the back side thereof, and the permanent magnet system (12) has a plurality of continuous, meshing magnetic pole tongues (17, 19) of opposing polarity and arranged in spaced relationship to each other, with said tongues being coupled together via a magnet bridge (20) and producing a magnetic field of meandering shape extending substantially solidly over the entire surface of the target plate.

REFERENCES:
patent: 4374722 (1983-02-01), Zega
patent: 4430190 (1984-02-01), Eilers et al.
patent: 4437966 (1984-03-01), Hope et al.
patent: 4461688 (1984-07-01), Morrison
patent: 4485000 (1984-11-01), Kawaguchi et al.
patent: 4498969 (1985-02-01), Ramachandrian
patent: 4500409 (1985-02-01), Boys et al.
patent: 4569745 (1986-02-01), Nagashima
patent: 4600489 (1986-07-01), Lefkow
patent: 4631106 (1986-12-01), Nakazato et al.

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