Process for cleaning and protecting semiconductor substrates

Fishing – trapping – and vermin destroying

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437250, 437946, H01L 2314

Patent

active

048837750

ABSTRACT:
A process for the production of semiconductor devices which comprises washing a cleaned semiconductor substrate with or without one or more component parts formed thereon, with pure water, freezing the pure water containing the washed substrate, preserving and/or transporting the ice-covered substrate, and thawing and drying the substrate before a subsequent process. The production process of the present invention can completely remove contamination on a surface of the semiconductor substrate in a wafer process and can stop the formation of a natural oxide coating on a surface of the substrate: Thus shortening and simplifying the wafer process, increasing the quality and yield of the semiconductor devices, and enabling the cleaned substrate to be preserved for a long period and transported to distant areas or far countries.

REFERENCES:
patent: 2930722 (1960-03-01), Ligenza
patent: 3103733 (1963-09-01), Favro et al.
patent: 3464104 (1969-09-01), Tonner et al.
patent: 3577286 (1971-05-01), Berkenblit et al.
Aspnes et al., Appl. Phys. Lett., V. 46, No. 11, (Jun. 1985), pp. 1071-1073.
IBM Tech. Disc. Bull., V. 27, No. 10A, (Mar. 1985), pp. 5602-5603.

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