Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1993-10-04
1994-10-04
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4271262, 4271263, 4273762, 4273763, 4274194, B05D 512
Patent
active
053524829
ABSTRACT:
A high heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region has a substrate having high heat conductivity. An oxidized layer is formed on a surface of the substrate. Electrically conductive layers formed of a printed paste containing crystallized glass, and insulating layers formed of a printed insulating paste containing crystallized glass as a principal constituent are alternately disposed by printing on the oxidized layer of the substrate. The conductive and insulating layers are heated to form solid layers between successive printing steps. The substrate is AlN, Sic/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductivity of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulting layer has a low dielectric constant.
REFERENCES:
patent: 4540671 (1985-09-01), Konda et al.
patent: 4659611 (1987-04-01), Iwase et al.
patent: 4795512 (1989-01-01), Nakatani et al.
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patent: 4943470 (1990-07-01), Shiromizu et al.
patent: 5070393 (1991-12-01), Nakagawa et al.
R. D. Jones, "Hybrid Circuit Design and Manufacture" Marcel Dekker, 1982, pp. 22-36.
J. F. Shackelford "Introduction to Materials Science for Engineers" Macmillan 1988, pp. 7-8.
Kondo Kazuo
Morikawa Asao
Beck Shrive
NGK Spark Plug Co. Ltd.
Utech Benjamin L.
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