TiW.sub.2 N Fusible links in semiconductor integrated circuits

Details TiW.sub.2 N Fusible links in semiconductor integrated circuits TiW.sub.2 N Fusible links in semiconductor integrated circuits

1982-04-23

1985-01-01

James, Andrew J.

Static information storage and retrieval

Magnetic bubbles

Guide structure

357 71, 357 51, 357 67, 357 23C, 365 96, 365103, 365104, H01L 21479, H01L 2170, H01L 2194, H01L 2354

Patent

active

044918607

ABSTRACT:
A film of titanitum-tungsten nitride is used to provide the dual function of a fuse link between a semiconductive device and an interconnect line in a memory array and of a barrier metal between another metal and a semiconductor region.

REFERENCES:
patent: Re28481 (1975-07-01), Shields et al.
patent: 4179533 (1979-12-01), Christou et al.
"High-Temperature Contact Structures for Silicon Semiconductor Devices", Author: Wittmer-Appl. Phys. Lett. 37(6), Sep. 15, 1980, American Institute of Physics, pp. 540-542.
Magnetron Sputtered Titanium-Tungsten Films, by M. Hill, Solid State Technology, Jan. 1980, pp. 53-59.
Simple Process Propels Bipolar Proms to 16K Density and Beyond, by R. K. Wallace and A. J. Learn, Electronics, Mar. 27, 1980, pp. 147-150.
Corrosion Resistance of Several Integrated Circuit Metallization Schemes, by J. A. Cunningham, C. R. Fuller C. T. Haywood, IEEE Transactions Rel, vol. 19, 1970, pp. 182-187.
Application of Titanium-Tungsten Barrier Metallization For Integrated Circuits, by P. B. Ghate, J. C. Blair, C. R. Fuller and G. E. McGuire, Thin Solid Films, vol. 53, 1978, pp. 117-128.
Studies of the Ti-W/Au Metallization on Aluminum, by R. S. Nowicki, J. M. Harris, M. A. Nicolet and I. V. Mitchell, Thin Solid Films, vol. 53, 1978, pp. 195-205.

Affiliated with

Also associated with

Rating

TiW.sub.2 N Fusible links in semiconductor integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with TiW.sub.2 N Fusible links in semiconductor integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and TiW.sub.2 N Fusible links in semiconductor integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-579909