Method for fabricating semiconductor components

Details Method for fabricating semiconductor components Method for fabricating semiconductor components

1998-07-06

2000-08-22

Booth, Richard

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438113, 438612, H01L 2144, H01L 2148, H01L 2150

Patent

active

061071196

ABSTRACT:
A method for fabricating semiconductor components such as printed circuit boards, multi chip modules, chip scale packages, and test carriers is provided. The method includes providing a substrate having a blanket deposited conductive layer thereon. Using a laser machining process, grooves are formed in the conductive layer to define patterns of conductors on the substrate. The conductors can be formed with a desired size and spacing, and can include features such as bond pads, conductive vias, and external ball contacts. In addition, selected conductors can be configured as co-planar ground or voltage traces, for adjusting impedance values in other conductors configured as signal traces.

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