Heat-conductive adhesive films, laminates with heat-conductive a

Details Heat-conductive adhesive films, laminates with heat-conductive a Heat-conductive adhesive films, laminates with heat-conductive a

1992-04-22

1994-03-01

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4283084, 428368, 428384, 428901, 174250, 174255, 174256, 174258, 174259, B32B 900

Patent

active

052906248

ABSTRACT:
A laminate comprising (a) a carrier having a heat conductivity of at least 10 W/mK and a thickness of 10 to 100 .mu.m, and (b) a dielectric adhesive layer which is applied to at least one surface of said substrate and which contains a heat-conductive filler and has a thickness of 5 to 500 .mu.m and a heat conductivity of 1 W/mK. The flexible laminate, or a dielectric and self-supporting adhesive film which contains a heat-conductive filler and has a heat conductivity of at least 1 W/mK, is suitable for removing heat from leadframes which have electrically insulated contact surfaces for electrical and electronic components and which are encapsulated with a synthetic resin moulding material, typically dual-in-line plastic packages, by bonding the rear sides of the contact surfaces to the leads.

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Chem Abst. JP 2,082,559.
Andrews et al IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHM T-4, pp. 455-461 (1981).
McPherson et al. International Reliability Physical Symposium pp. 224-228 (1987).
Leung et al. Hybrid Circuits, No. 18, pp. 22-24 (1989).

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