Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1996-07-02
1998-05-05
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257718, 257719, 257724, H01L 23043, H01L 2310
Patent
active
057478759
ABSTRACT:
In order to obtain a miniature unit having a simple structure which can operate at a high speed at a low cost, a copper pattern (225) provided on a power substrate (221) having a DBC substrate structure is exposed on an outer surface of the unit. Thus, it is possible to discharge heat which is generated in a main circuit of the unit to the exterior without providing a copper base plate by mounting the unit so that the pattern (225) is directly in contact with an external heat slinger or the like. The power substrate (221) is not deformed following its temperature change, since no copper base plate is required. Thus, no S-bent structure is required for a terminal which is connected with the circuit or the like, whereby speed increase and miniaturization are enabled, while the structure is simplified since no silicone gel is required.
REFERENCES:
patent: 5521437 (1996-05-01), Oshima et al.
Brown Peter Toby
Mitsubishi Denki & Kabushiki Kaisha
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