Process for manufacturing ceramic multilayer substrate

Details Process for manufacturing ceramic multilayer substrate Process for manufacturing ceramic multilayer substrate

1993-01-21

1994-03-01

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

427 96, 4271262, 427314, 4273761, 427380, 4274191, B32B 1800

Patent

active

052903753

ABSTRACT:
A ceramic multilayer substrate, containing a stack of alternate ceramic and inner conductor layers, the conductor layer having a melting point higher than a lowest firing temperature of the ceramic layer, the stack having a top ceramic layer, and a conductor layer formed on the stack, the conductor layer being electrically connected to the inner conductor layer, is characterized by further including an insulating layer formed on the top ceramic layer of the stack and under the insulating layer, the insulating layer having a firing temperature lower than the lowest firing temperature of the ceramic layer.

REFERENCES:
patent: 4861646 (1989-08-01), Barringer et al.
patent: 4880684 (1989-12-01), Boss et al.
IBM Technical Disclosure Bulletin, Ceramic Surface Preparation, vol. 16, No. 2, Jul. 1973.

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