Apparatus for wet processing

Details Apparatus for wet processing Apparatus for wet processing

1984-06-27

1985-12-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

134 33, 134198, 156639, 156640, H01L 21306, C23F 100, B44C 122, C03C 1500

Patent

active

045577854

ABSTRACT:
An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing chamber through an opening and nozzles, and the substrate is floated in the injected liquid and rotated about its center axis by streams of the injected liquid. The wet processing system is composed from a processing apparatus as mentioned above, a water bearing system which transfers the substrate by means of a water stream, and a spin dryer. The water bearing system also serves as a washing apparatus. Shutters are provided between the water bearing and the processing chamber or the spin dryer, the shutters controlling the water levels between these elements.

REFERENCES:
patent: 3664354 (1972-05-01), Minbiole et al.
IBM Technical Disclosure Bulletin, vol. 16, No. 9, Feb. 1974, "Semiconductor Wafer Wet Processing Rotating Apparatus".
Patent Abstracts of Japan, vol. 6, No. 191, Sep. 30, 1982 of JP-A-57-104669.

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