Fluxless soldering process

Details Fluxless soldering process Fluxless soldering process

1992-07-21

1994-03-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228220, B23K 1008

Patent

active

052899640

ABSTRACT:
A fluxless soldering process comprising the steps of: preparing first and second members to be bonded by soldering, the first member having a bonding surface with a higher solder-wettability and the second member having a bonding surface with a lower solder-wettability; placing the second member with the bonding surface thereof facing upward, a solder foil on the bonding surface of the second member, and the first member on the solder foil and with the bonding surface thereof facing downward, to form an assembly; heating the assembly in a reducing atmosphere to fuse the solder foil, thereby forming a molten solder between the first and second members; and cooling the assembly to solidify the molten solder, thereby bonding the first and second members.

REFERENCES:
patent: 2330062 (1943-09-01), Lempert
patent: 2897583 (1959-08-01), Patrichi
patent: 3487536 (1970-01-01), Goldstein
patent: 4331253 (1982-05-01), Gordon et al.
patent: 5048744 (1991-09-01), Chang et al.
patent: 5121871 (1992-06-01), Beavis et al.
R & D Magazine, Cahners Publishing Company, U.S.A.

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