Method of inspecting an array of solder ball connections of an i

Details Method of inspecting an array of solder ball connections of an i Method of inspecting an array of solder ball connections of an i

Filed on

1994-08-12

Date issued

1996-11-12

Examiner

Mancuso, Joseph

Patent Class

Image analysis

SubClass

Applications

SubSubClass

Manufacturing or product inspection

Other Related Categories

382148, G06K 900

Type

Patent

Status

active

Patent number

055748015

Description

ABSTRACT:
A method of inspecting an array of balls used as connections in integrated circuit modules such as Solder Ball Connection modules, by means of an inspection apparatus that includes a microprocessor (34), a support (32) for holding in place the modules to be inspected (30), the microprocessor controlling a vertical camera (38) and a tilted camera (40) for obtaining images of the balls, wherein said method includes measuring the X and Y coordinates of each ball of the array to determine a best fitting grid of the balls, detecting the Z coordinate of each ball to determine the best fitting plane for the array of balls, offsetting the best fitting plane such that the offset plane also includes the lowest ball of the array, computing the deviation between each ball and the offset plane, and comparing the computed deviations with predetermined specifications to ascertain whether the inspected module is in compliance with the specifications.

REFERENCES:
patent: 3721825 (1973-03-01), Rasmussen, Jr.
patent: 4296474 (1981-10-01), Hurt
patent: 4677473 (1987-06-01), Okamoto et al.
patent: 4688939 (1987-08-01), Ray
patent: 5058178 (1991-10-01), Ray
patent: 5108024 (1992-04-01), Kazem-Goudarzi et al.
patent: 5134665 (1992-07-01), Jyoko
patent: 5137362 (1992-08-01), LeBeau
patent: 5161202 (1992-11-01), Kitakado et al.
patent: 5368217 (1994-11-01), Simmons et al.
patent: 5376790 (1994-12-01), Linker et al.
patent: 5394246 (1995-02-01), Sugawara
W. E. Blanz, et al., "Image Analysis Methods for Solder Ball Inspection in Integrated Circuit Manufacturing" IEEE, pp. 509-514, 1987.
Disclosed Anonymously No. 33317, "Solder Ball Connection (SBC) Co-Planarity with X-Ray Technology" Havant GB, Jan. 1992.

Affiliated with

Also associated with

Rating

Method of inspecting an array of solder ball connections of an i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of inspecting an array of solder ball connections of an i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of inspecting an array of solder ball connections of an i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-569614