Methods of depositing metallic copper on substrates

Radiation imagery chemistry: process – composition – or product th – Post imaging processing – Physical developing

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427 541, 427 92, 427 98, 4274431, B05D 306

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043048498

ABSTRACT:
In an improved method for depositing a metal on a substrate of the type in which a dielectric coated substrate is coated with a sensitizing solution containing a reductible metal salt, a primary reducing agent comprising 2,7 anthraquinone disulfonic acid and a secondary reducing agent, the substrate is exposed to ultraviolet light in an atmosphere having a temperature of at least 117.degree. F. (42.degree. C.) and a mass of water vapor of at least 3.8 mg of water per liter of dry air for at least 15 seconds. In an embodiment of the method the substrate is aerated in a moisture controlled atmosphere at room temperature for at least 30 minutes prior to exposing the substrate to ultraviolet light.

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patent: 3697319 (1972-10-01), Feldstein
patent: 3758332 (1973-09-01), Dinella et al.
patent: 3925578 (1975-12-01), Polichette et al.
patent: 3949121 (1976-04-01), Kenney
patent: 4098922 (1978-07-01), Dinella et al.

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