Mounting apparatus for grid array packages

Details Mounting apparatus for grid array packages Mounting apparatus for grid array packages

1996-07-15

2000-01-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361767, 361772, 361774, 439 71, 257692, 257697, 257726, 257727, H05K 0712

Patent

active

060162546

ABSTRACT:
Grid array device packages are mounted on a circuit board or other substrate with a socket having a base member, a retaining member and an array of bent contact pins. The ends of the contact pins are displaced by insertion of a device package and then respond with a small spring force to hold the device package in place against ledges on the retaining member. The contact ends of the pins make electrical connection with terminals on the device package. A sufficient portion of each pin is implanted within the base member to prevent stress from passing through the base member. The retaining member leaves a significant portion of the upper surface of the device package exposed so that packages with attached heat sinks may be mounted therein.

REFERENCES:
patent: 3820054 (1974-06-01), Clewes et al.
patent: 4222622 (1980-09-01), Griffin et al.
patent: 5437556 (1995-08-01), Bargain et al.

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