Method of manufacturing a semiconductor device

Fishing – trapping – and vermin destroying

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H01L 218242

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active

055630855

ABSTRACT:
In formation of a DRAM, a silicon nitride film is used as a mask to simultaneously expose a semiconductor substrate serving as an active region where an MOSFET is formed and a portion of the periphery of a trench. Therefore, even if the alignment offset of a resist pattern occurs, an interval between adjacent memory cells does not change. The interval between the adjacent memory cells is constantly the same as that when no alignment offset of the resist patter occurs. That is, only an n-type diffusion layer of the memory cell formed at a position adjacent to the trench comes close to source and drain regions of the adjacent memory cell.

REFERENCES:
patent: 4566914 (1986-01-01), Hall
patent: 4578142 (1986-03-01), Corboy, Jr. et al.
patent: 4728623 (1988-03-01), Lu et al.
patent: 4873205 (1989-10-01), Critchlow et al.
patent: 4916524 (1990-04-01), Teng et al.
patent: 4927779 (1990-03-01), Dhong et al.
patent: 4969022 (1990-11-01), Nishimoto et al.
patent: 4988637 (1991-01-01), Dhong et al.
patent: 5075248 (1991-12-01), Yoon et al.
patent: 5102819 (1992-04-01), Malsushita et al.
patent: 5302542 (1994-04-01), Kishi et al.
"Flanged Trench Capacitor Cell" IBM TDB vol. 30, No. 5, Oct. 1987 pp. 410-411.
Isolation Merged Stacked Dynamic Random-Access Memory Cell. IBM TDB vol. 31, No. 7 Dec. 1988 pp. 39-40.

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