Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1998-03-02
2000-01-18
Hoang, Tu Ba
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
219400, 432128, F27B 906
Patent
active
060159669
ABSTRACT:
In reflow soldering systems the circuit boards are conventionally transported in horizontal direction from a feed portion through a preheating portion, a main heat-treatment portion, a cooling portion and a discharge portion in linear fashion in the longitudinal direction of the system. Such reflow systems, however, are relatively long and therefore require a lot of space. According to the invention, a heating apparatus, in particular for a reflow solder system, for heating circuit boards is provided with a feed portion for feeding the circuit boards in a substantially horizontal direction, at least one heating portion following in transportation direction downstream of said feed portion, a discharge portion for discharging circuit boards supplied from the heating portion in a substantially horizontal direction, and with a transportation device connecting feed portion, heating portion and discharge portion, characterized in that a transportation path of the transportation device extends in the heating portion in a plane substantially in a direction transverse to the horizontal feed or discharge direction, and the transportation path connects feed and discharge portions in a substantially ring-like configuration.
REFERENCES:
patent: 4020273 (1977-04-01), Dix et al.
patent: 5193735 (1993-03-01), Knight
patent: 5573174 (1996-11-01), Pekol
patent: 5573688 (1996-11-01), Chanasyk et al.
patent: 5922230 (1999-07-01), Yokota
Fuqua Shawntina
Hoang Tu Ba
Rehm Anlagenbau GmbH & Co.
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