Heat dissipating lead connector for semiconductor packages

Details Heat dissipating lead connector for semiconductor packages Heat dissipating lead connector for semiconductor packages

1982-08-16

1985-01-22

McGlynn, Joseph H.

Geometrical instruments

339 17CF, H01R 1305

Patent

active

044948140

ABSTRACT:
A heat dissipating connector for semiconductor package leads is disclosed. The body of the connector is comprised of two oppositely facing fingers formed from a unitary strip by making a 180 degree bend transverse to the longitudinal axis of the strip. A heat dissipating fin is formed integrally with an edge of one of the fingers, and protrudes substantially perpendicular to the vertical centerline of the heat dissipating connector body. In its installed condition, the facing surfaces of the fingers engage a semiconductor package lead with a spring force urged from the spring configuration of one of the fingers. The integrated circuit electrical lead, when mounted between the engaging surfaces of the oppositely facing fingers, is gripped in place, thereby maintaining a good heat and electrically conductive relationship therewith.

REFERENCES:
patent: Re29513 (1978-01-01), Johnson
patent: 3670215 (1972-06-01), Wilken et al.
patent: 3850500 (1974-11-01), Cobaugh et al.
patent: 4073561 (1978-02-01), Baranowski
patent: 4077687 (1978-03-01), Farag
patent: 4415212 (1983-12-01), DePillo

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