Method of removing coating from edge of substrate

Details Method of removing coating from edge of substrate Method of removing coating from edge of substrate

1997-05-21

2000-01-18

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 2, 134 32, 134 33, 134 34, 134 38, B08B 102, B08B 308, B08B 312

Patent

active

060154675

ABSTRACT:
In a method of removing a coating from an edge of a substrate a solvent reservoir is filled with a solvent to dissolve and remove a photoresist film, the solvent includes one of dipropylene glycol monoalkyl ether, a mixture of this ether and an easily volatile organic solvent (boiling point of 75-130.degree. C., vapor pressure of 5-75 mmHg at 20.degree. C.), and an alkaline aqueous solution, an edge of a substrate W is horizontally inserted in the reservoir, and thereafter, the edge of the substrate W is immersed in the solvent for a period of time, so as to dissolve and remove a coating such as photoresist from the edge of the substrate. The solvent may be filled into the solvent reservoir either before or after the edge of the substrate is inserted therein, and the method may further involve aspirating the solvent from the reservoir after the substrate edge has been inserted therein.

REFERENCES:
patent: 4592787 (1986-06-01), Johnson
patent: 4886728 (1989-12-01), Salamy et al.
patent: 5334332 (1994-08-01), Lee
patent: 5643818 (1997-07-01), Sachdev et al.
patent: 5688411 (1997-11-01), Kutsuzawa et al.
patent: 5849467 (1998-12-01), Sato et al.

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