Polishing apparatus

Abrading – Machine – Rotary tool

Patent

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Details

451287, 451 41, B24B 500, B24B 2900

Patent

active

060153377

ABSTRACT:
A polishing apparatus for polishing for example a semiconductor wafer to a high degree of flatness includes a turntable to the upper surface of which is affixed a polishing cloth and a top ring. A surface of the workpiece interposed between the polishing cloth on the turntable and the top ring is polished by pressing the workpiece against the polishing cloth with a predetermined pressure and moving the turntable and the top ring relative to each other. The turntable includes a set of annular small tables each of which is smaller than the diameter of the workpiece and determined on the basis of an area of effect on the workpiece.

REFERENCES:
patent: 2826015 (1958-03-01), Osenberg
patent: 2867063 (1959-01-01), Metzger
patent: 3891409 (1975-06-01), Keith, Jr.
patent: 5007207 (1991-04-01), Phaal
patent: 5377451 (1995-01-01), Leoni et al.
patent: 5503592 (1996-04-01), Neumann

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