Housing arrangement for miniaturized electronic devices

Details Housing arrangement for miniaturized electronic devices Housing arrangement for miniaturized electronic devices

1975-03-13

1976-07-20

Tolin, Gerald P.

317101F, H05K 706

Patent

active

039709027

ABSTRACT:
An improved miniaturized housing arrangement is disclosed for releasably mounting a chassis, such as a printed circuit board, using the contours and the resiliency of the housing itself to retain and release the board. No special tools are required nor any added hardware. The mounting arrangement captivates only small edge portions of the printed circuit board so as to avoid using valuable space on the board that may be devoted to circuitry and the like. The PC board is also fixedly connected to circuitry provided on a non-rigid base ("flex circuit"). The flex circuit is intended primarily for electrical interconnection but also provides a hinge capability for the board when the latter is released. A strain relief device releasably retains the flex circuit within the housing and prevents damage during hingeing action.

REFERENCES:
patent: 3780353 (1973-12-01), Gordon
patent: 3873889 (1975-03-01), Leyba
patent: 3904074 (1975-09-01), Hoffman

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