Methods and apparatus for the non-destructive testing of bonded

Details Methods and apparatus for the non-destructive testing of bonded Methods and apparatus for the non-destructive testing of bonded

1977-04-18

1978-05-23

Myracle, Jerry W.

Measuring and testing

Ductility or brittleness

73582, G01N 2900

Patent

active

040904008

ABSTRACT:
A beam lead device which has been thermocompressively bonded to a substrate is non-destructively tested to determine the strength thereof by directing a short burst of air at the device and detecting the Stress Wave Emission (SWE) signals emanating from the bond site subsequent to said burst of air. The SWE signals are then processed to determine the strength of the adhesion bond.

REFERENCES:
patent: 3531982 (1970-10-01), Clotfelter et al.
patent: 3605486 (1971-09-01), Anderholm et al.
patent: 3924456 (1975-12-01), Vahaviolos

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