Direct solder bumping of hard to solder substrate

Details Direct solder bumping of hard to solder substrate Direct solder bumping of hard to solder substrate

1997-01-27

2000-01-18

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228219, 228256, B23K 100, B23K 3102

Patent

active

060150831

ABSTRACT:
A method has been formed for direct solder "bumping" of wafers, chips and interconnection pads or traces on hard to solder surfaces such as aluminum and indium tin oxide. It has been discovered that conventional solders modified by the addition of a light reactive metal can be jetted in the form of microdroplets onto a hard to solder substrate and that the modified droplets will wet and bond to the surface of the hard to solder substrate. This makes it possible for the first time to create solder bumps on bare uncoated hard to solder substrates such as aluminum and indium tin oxide without the need for first applying a different surface which conventional solder will wet.

REFERENCES:
patent: 3881953 (1975-05-01), Turowski
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patent: 4588657 (1986-05-01), Kujas
patent: 4917861 (1990-04-01), Schaffer et al.
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patent: 5120498 (1992-06-01), Cocks
patent: 5193738 (1993-03-01), Hayes
patent: 5597110 (1997-01-01), Melton et al.
"Solder for Bonding Semiconductor Chip to Header . . . ," Derwent-ACC-No.: 1980-50474C (Abstract for JP 55-72047A).

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