Solder plating process

Details Solder plating process Solder plating process

1979-12-31

1981-04-21

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 54R, C25D 332, C25D 336, C25D 360

Patent

active

042631068

ABSTRACT:
A process for electroplating tin, lead or alloys of tin and lead from aqueous acidic baths. The baths comprise lactones, lactams, cyclic sulfate esters, cyclic imides and cyclic oxazolinones. The additives assist in providing a process which permits high speed plating with excellent layer properties such as smooth platings free from dendritic growth and having constant plating thickness over wide areas.

REFERENCES:
patent: 3661730 (1972-05-01), Nishihara
patent: 3749649 (1973-07-01), Valayil
patent: 3875029 (1975-04-01), Rosenberg et al.
patent: 3956123 (1976-05-01), Rosenberg et al.
patent: 4007047 (1976-12-01), Ostrow et al.
patent: 4162205 (1979-07-01), Wilson et al.
Robert Taft et al., Trans. Kansas Academy of Science, vol. 42, pp. 173-188, (1942).
A. Kenneth Graham et al., Tech. Proc. Am. Electroplater's Soc., vol. 50, pp. 139-146, (1963).
Abner Brenner, "Electrodeposition of Alloys", vol. II, pp. 4-25, (1963).

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