Sludge-limiting tin and/or lead electroplating bath

Details Sludge-limiting tin and/or lead electroplating bath Sludge-limiting tin and/or lead electroplating bath

1995-09-01

1996-10-08

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205252, 205255, 205299, 205300, C25D 356, C25D 360, C25D 330

Patent

active

055628141

ABSTRACT:
A novel electroplating bath is described which comprises an alkane or alkanol sulfonic acid, tin, lead or tin-lead metal alloy and either an alkali carbonate or alkali bicarbonate salt. The addition of the alkali carbonate or bicarbonate salts reduces tin oxidation and thus decreases the amount of sludge formation in the bath.

REFERENCES:
patent: 4459185 (1984-07-01), Obata et al.
patent: 4565609 (1986-01-01), Nobel et al.
patent: 4582576 (1986-04-01), Opaskar et al.
patent: 4599149 (1986-07-01), Nobel et al.
patent: 4617097 (1986-10-01), Nobel et al.
patent: 5066367 (1991-11-01), Nobel et al.
patent: 5364459 (1994-11-01), Senda et al.

Affiliated with

Also associated with

Rating

Sludge-limiting tin and/or lead electroplating bath does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Sludge-limiting tin and/or lead electroplating bath, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Sludge-limiting tin and/or lead electroplating bath will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-54967