Wiring structure of semiconductor pressure sensor

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357 26, 357 55, 73777, 73727, H01L 2348, H01L 2984, H01L 2906, G01L 906

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active

049086936

ABSTRACT:
A semiconductor pressure sensor comprises a sensor chip including an etching stop layer of high concentration impurity ions formed by ion implantation of impurity ions into a substrate of silicon single crystal or by deposition and diffusion and an epitaxial growth layer of silicon single crystal on the etching stop layer, a recess formed in the back of the sensor chip by etching, circuit elements formed on the sensor chip, diffusion leads for connecting the circuit elements, connecting regions, each formed between the etching stop layer and a predetermined position on the surface of the sensor chip, and diffusion regions, each formed between the predetermined position and one of terminals of the circuit elements.

REFERENCES:
patent: 3994009 (1976-11-01), Hartlaub
patent: 4203128 (1980-05-01), Guckel et al.
patent: 4314226 (1982-02-01), Oguro et al.
patent: 4320664 (1982-03-01), Rehn et al.
patent: 4332000 (1982-05-01), Petersen
patent: 4410871 (1983-10-01), Mallon et al.
patent: 4426768 (1984-01-01), Black et al.
patent: 4588472 (1986-05-01), Shimizu
patent: 4654621 (1987-03-01), Sugiyama
patent: 4672354 (1987-06-01), Kurtz et al.
Patent Abstracts of Japan, Semiconductor Composite Sensor, Sumitomo Denki Kogyo K.K., Jun. 10, 1986, vol. 10 No. 10 162 (P-466)(2218).
Patent Abstracts of Japan, Semiconductor Composite Sensor, Sumitomo Denki Kogyo K.K., Nov. 19, 1985, vol. 9 No. 292 (P-406)(2015).
Regelungstechnische Praxis, U. Theden et al, "Halbleiter-Druckaufnehmer Mit . . . ", vol. 24, No. 7, Jul. 1982 pp. 223-230.

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