Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Patent
1994-11-07
1996-10-08
Silbaugh, Jan H.
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
134 2, 134 18, 134 32, 134 33, 134 34, B08B 312, B08B 704, B08B 102, C03C 2300
Patent
active
055627781
ABSTRACT:
An ultrasonic jet semiconductor wafer cleaning method and apparatus for removing debris from a surface of a semiconductor wafer as the wafer is rotated about a prescribed axis in a cleaning plane whereby a housing having a principal axis, an inlet port, and an outlet port is provided. The method further includes producing focused ultrasonic waves of acoustic energy concentric with and incident the outlet port to form a jet stream of cleaning liquid released through the outlet port; adjustably positioning a focal point of the focused ultrasonic waves between a first focal point position and a second focal point position along an axis; and sweeping the housing in an reciprocating manner along a sweep path.
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Koretsky Ronald G.
Vigliotti, deceased Donald R.
von Gutfeld Robert J.
Balconi-Lamica Michael J.
Gray Robin S.
International Business Machines - Corporation
Murray Susan M.
Silbaugh Jan H.
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