Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

1976-02-17

1977-03-29

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

040147606

ABSTRACT:
This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:
A. an aryl amine selected from those exhibiting the formulae: ##STR1## and its reaction product.sup.2 with propane sultone; ##STR2## wherein Z is selected from the group consisting of oxygen and --NCH.sub.2 --C.sub.6 H.sub.5 ;
B. sulfoalkyl sulfide compounds containing the grouping --S--Alk--SO.sub.3 M where M is one gram-equivalent of a cation and --Alk-- is a divalent aliphatic hydrocarbon group of 1 to 8 carbon atoms.

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