Organic solder barrier

Details Organic solder barrier Organic solder barrier

1988-06-27

1990-03-13

Hille, Rolf

357 80, 357 68, H01L 2314, H01L 2318, H01L 2312

Patent

active

049086898

ABSTRACT:
A system for defining a solder barrier using a silylated positive photoresist. This layer replaces the top chrome layer previously employed and defines the C4 and I/O select patterns. The personality pattern in the Cr-Cu layers is defined by the use of a positive photoresist which is etched to provide the copper etch mask. The etched copper is then used to etch the chrome. This avoids the incompatibility of the positive photoresist with the alkaline chromium etchant.

REFERENCES:
patent: 3373323 (1968-03-01), Wolfrum et al.
patent: 3392442 (1966-07-01), Napier et al.
patent: 3495133 (1970-02-01), Miller
patent: 3668025 (1972-06-01), Blum et al.
patent: 4328262 (1982-05-01), Kurahashi et al.
Cortellino et al.--"Dielectric Sputtering for Multilayer Circuitry"--IBM Technical Disclosure Bulletin--vol. 14, No. 2, Jul. 1971, p. 429.

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