Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1999-06-21
2000-07-11
Picardat, Kevin M.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257676, 257690, H01L 23495
Patent
active
060877154
ABSTRACT:
To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11 has a base member 11a essentially consisting of Cu and an oxide film 11b essentially consisting of an oxide of the base member 11a formed on the base member and having a thickness of about 50 nm or below. By controlling the oxide film 11b to a thickness of about 50 nm or below, an adhesion strength with the sealing resin 14 is improved greatly, so that a package crack does not occur even if a large thermal load is applied in a reflow process for mounting.
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Kurosu Atsushi
Sawada Kanako
Takahashi Kenji
Yoo Hee Yeoul
Anam Industrial Co., Ltd.
Kabushiki Kaisha Toshiba
Picardat Kevin M.
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