Method for preparing complementary semiconductor device

Metal working – Method of mechanical manufacture – Assembling or joining

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29578, 148 15, 148187, 148190, 357 42, 357 59, 357 91, H01L 2122, H01L 21265

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042802725

ABSTRACT:
A complementary semiconductor device includes P-and N-type semiconductor regions separately formed in a semiconductor substrate and having substantially the same concentration of impurities. N-and P-channel type silicon gate field effect transistors are formed in the P-and N-channel type regions, respectively. Gate electrodes of the P-and N-channel type silicon gate field effect transistors are formed by polycrystalline silicons of the same conductivity type. An impurity of the same conductivity type is doped into both the semiconductor regions to provide channel doped regions.

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Lin et al., "Shielded Silicon Gate Complementary Mos . . . Circuit", IEEE Trans. Electron Dev., vol. ED-19, No. 11, Nov. 1972, pp. 1199-1207.

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