Semiconductor device with heat transfer cap

Details Semiconductor device with heat transfer cap Semiconductor device with heat transfer cap

1989-08-03

1991-09-10

Jackson, Jr., Jerome

Boots, shoes, and leggings

357 70, 364388, H01L 2302

Patent

active

050478370

ABSTRACT:
A packaged semiconductor device having heat transfer leads carrying a semiconductor chip directly or indirectly through a chip pad and extended to the exterior of the plastic or ceramics seal of the package, and a heat transfer cap held in surface contact with the extended heat transfer leads and covering upper side of the package. The heat generated in the semiconductor chip is transmitted to the upper side of the package and to the printed circuit board only through metallic parts so that the heat transfer is enhanced to remarkably reduce thermal resistance, thus enabling packaging of a semiconductor chip having a large heat generation rate.

REFERENCES:
patent: 3786317 (1974-01-01), Thierfelder
patent: 4209798 (1980-06-01), Beretta
patent: 4561006 (1985-12-01), Carrie
patent: 4926242 (1990-05-01), Itoh et al.

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